Sputtering System for Ion Beam

Sputtering by plasma for high evaporation temperature materials.

For some materials or compounds it is not possible to use the furnace due to their high evaporation temperature. In this case, the sputtering technique can be used: wires of material are placed inside a tube support and are placed close to the plasma. Due to the consumption of the material, it is necessary to move the sample when the length is reduced. The mechanism (insulated at 30 kV) includes a motor, a read back potentiometer, end-switches mounted on the source support and grounded (with respect to the extraction potential). Command & Control of the movement is normally integrated in our command and control system. A linear transfer feed-through, placed after the mechanism, allows the equipment to retract, after the vacuum lock-chamber valve.